The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging facility in Singapore to meet rising global demand for artificial intelligence ...

The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Micron Technology is set to invest S$9.6bn ($7bn) in Singapore over several years to meet the rising demand for advanced memory chips driven by artificial intelligence (AI). The US semiconductor ...

SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s ...