Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Applied Materials' leadership in HBM manufacturing ensures it captures substantial market opportunities. Learn why AMAT stock ...

The TC bonder, a crucial tool in the HBM manufacturing process, is used to stack chips vertically. SK hynix’s method involves repeatedly lifting the chip dies slightly with the TC bonder ...

SK hynix begins sampling the world's first 12-layer HBM4 memory samples with up to 36GB capacity, 2TB/sec bandwidth: ready ...

TC bonder, an essential piece of equipment in the HBM manufacturing process, stacks multiple chips vertically. In the case of SK hynix, the process of slightly placing chip dies with the TC bonder ...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high ...