Semiconductor Engineering7h
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, ...
Semiconductor Engineering3d
Chip Industry Week in Review
The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...
Semiconductor Engineering6d
Auto Ecosystem Begins Shift To Software-First Transition
Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...
Semiconductor Engineering6d
Top Tech Videos Of 2024
In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...
Semiconductor Engineering7d
2D Ferroelectric Field-Effect Transistors (Penn State, U. of Minnesota)
A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO 3 nanomembranes at sub-ambient temperatures” was published by researchers at Penn ...
Semiconductor Engineering7d
Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)
A new technical paper titled “Memory-Centric Computing: Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. “Memory-centric computing aims to enable computation ...