Axus Technology announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide ... Semiconductor Packaging News is ...
SkyWater Technology announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO ... Semiconductor Packaging News is ...
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator ...
The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized ... The STPMIC25 power-management IC ...
Siemens Digital Industries Software announced that Japan-based Preferred Networks Inc. (PFN) has selected Siemens' PowerPro™ software to optimize the power efficiency ... Siemens Digital Industries ...
Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and ...
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly ... Indium Corporation Senior ...
SK hynix starts mass production of world's first 12-layer HBM3E: Summary SK hynix has begun mass production of its world-first 12-layer HBM3E chips, strengthening its lead in the ...
Global chip stocks surged on Thursday after Micron's revenue guidance exceeded expectations, driving its shares up 15%. Rivals Samsung and SK Hynix gained over 4% and 9% respectively, with SK Hynix ...
Taiwan ramps up semiconductor innovation with US$9.3 billion initiative and global talent drive: Summary Taiwan's Central Bank stressed the nation's crucial semiconductor role ami ...
AI is revolutionizing the semiconductor industry by enabling better data integration & problem-solving across the global ecosystem. Generative AI & large language models help engineers connect diverse ...
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