Semiconductor Packaging News4d
Axus Technology Delivers Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers
Axus Technology announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide ... Semiconductor Packaging News is ...
Semiconductor Packaging News1y
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications ... Siemens Digital ...
Semiconductor Packaging News1y
SONOTEC with Compact Flow Meter Series for Semiconductor Applications at ICPT
We are optimistic about the upcoming months, although the uncertainty on the markets continues to influence our daily decisions. In recent years, we have learned to act prudently and flexibly. We have ...
Semiconductor Packaging News2mon
STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power ... The HFA80A automotive-grade ...
Semiconductor Packaging News4d
SkyWater Names Bassel Haddad as SVP & General Manager of Advanced Packaging
SkyWater Technology announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO ... Semiconductor Packaging News is ...
Semiconductor Packaging News4d
New CEA-Leti Technology Improves DC-DC Converter Efficiency
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator ...
Semiconductor Packaging News6d
Flexible, space-saving class-D amplifier for in-car audio adds automotive-optimized diagnostics
The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized ... The STPMIC25 power-management IC ...
Semiconductor Packaging News4d
Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
Siemens Digital Industries Software announced that Japan-based Preferred Networks Inc. (PFN) has selected Siemens' PowerPro™ software to optimize the power efficiency ... Siemens Digital Industries ...
Semiconductor Packaging News10d
ST launches highly-integrated power-management IC for its latest microprocessors
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power ... The HFA80A automotive-grade ...
Semiconductor Packaging News6d
James J. Kim to Retire as Executive Chairman
Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and ...
Semiconductor Packaging News6d
Indium Corporation Experts to Present Advanced Research at IMAPS
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly ... Indium Corporation Senior ...
Semiconductor Packaging News10d
Awards Made in First Round of Microelectronics Commons Call for Projects, Totaling Nearly $269M
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